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[Report] Adapted to the new color names 

- Much longer because they are the dielectric name
This commit is contained in:
Salvador E. Tropea 2023-02-17 10:50:47 -03:00
parent 5962a6e2c7
commit 37e5e5fe95
11 changed files with 212 additions and 94 deletions
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6
kibot/resources/report_templates/report_full.txt
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@ -37,11 +37,11 @@ Impedance controlled: YES
#?stackup
#?stackup
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
#?stackup
|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
#?stackup
#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-8s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-16s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
#?stackup
# Important sizes

6
kibot/resources/report_templates/report_full_svg.txt
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@ -37,11 +37,11 @@ Impedance controlled: YES
#?stackup
#?stackup
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
#?stackup
|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
#?stackup
#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-8s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-16s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
#?stackup
# Important sizes

6
kibot/resources/report_templates/report_simple.txt
View File

@ -35,11 +35,11 @@ Impedance controlled: YES
#?stackup
#?stackup
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
#?stackup
|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
#?stackup
#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-8s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-16s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
#?stackup
Materials:

6
tests/board_samples/kicad_7/light_control.kicad_pcb
View File

@ -42,11 +42,11 @@
(layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (color "Blue") (thickness 0.01) (material "Liquid Ink") (epsilon_r 3.3) (loss_tangent 0))
(layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "prepreg") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "dielectric 1" (type "prepreg") (color "PTFE natural") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In1.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 2" (type "core") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "dielectric 2" (type "core") (color "FR4 natural") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In2.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 3" (type "prepreg") (thickness 0.24) (material "Kapton") (epsilon_r 3.2) (loss_tangent 0.004)
(layer "dielectric 3" (type "prepreg") (color "Polyimide") (thickness 0.24) (material "Kapton") (epsilon_r 3.2) (loss_tangent 0.004)
addsublayer (thickness 0.24) (material "Kapton") (epsilon_r 3.2) (loss_tangent 0.004))
(layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (color "Red") (thickness 0.01) (material "Dry Film") (epsilon_r 3.3) (loss_tangent 0))

57
tests/board_samples/kicad_7/light_control.kicad_pro
View File

@ -64,20 +64,26 @@
"rule_severities": {
"annular_width": "error",
"clearance": "error",
"connection_width": "warning",
"copper_edge_clearance": "error",
"copper_sliver": "warning",
"courtyards_overlap": "error",
"diff_pair_gap_out_of_range": "error",
"diff_pair_uncoupled_length_too_long": "error",
"drill_out_of_range": "error",
"duplicate_footprints": "warning",
"extra_footprint": "warning",
"footprint": "error",
"footprint_type_mismatch": "error",
"hole_clearance": "error",
"hole_near_hole": "error",
"invalid_outline": "error",
"isolated_copper": "warning",
"item_on_disabled_layer": "error",
"items_not_allowed": "error",
"length_out_of_range": "error",
"lib_footprint_issues": "warning",
"lib_footprint_mismatch": "warning",
"malformed_courtyard": "error",
"microvia_drill_out_of_range": "error",
"missing_courtyard": "ignore",
@ -87,9 +93,14 @@
"padstack": "error",
"pth_inside_courtyard": "ignore",
"shorting_items": "error",
"silk_edge_clearance": "warning",
"silk_over_copper": "warning",
"silk_overlap": "warning",
"skew_out_of_range": "error",
"solder_mask_bridge": "error",
"starved_thermal": "error",
"text_height": "warning",
"text_thickness": "warning",
"through_hole_pad_without_hole": "error",
"too_many_vias": "error",
"track_dangling": "warning",
@ -98,7 +109,6 @@
"unconnected_items": "error",
"unresolved_variable": "error",
"via_dangling": "warning",
"zone_has_empty_net": "error",
"zones_intersect": "error"
},
"rules": {
@ -106,18 +116,63 @@
"allow_microvias": false,
"max_error": 0.005,
"min_clearance": 0.0,
"min_connection": 0.0,
"min_copper_edge_clearance": 0.024999999999999998,
"min_hole_clearance": 0.25,
"min_hole_to_hole": 0.25,
"min_microvia_diameter": 0.19999999999999998,
"min_microvia_drill": 0.09999999999999999,
"min_resolved_spokes": 2,
"min_silk_clearance": 0.0,
"min_text_height": 0.7999999999999999,
"min_text_thickness": 0.08,
"min_through_hole_diameter": 0.2032,
"min_track_width": 0.127,
"min_via_annular_width": 0.049999999999999996,
"min_via_diameter": 0.4572,
"solder_mask_to_copper_clearance": 0.0,
"use_height_for_length_calcs": true
},
"teardrop_options": [
{
"td_allow_use_two_tracks": true,
"td_curve_segcount": 5,
"td_on_pad_in_zone": false,
"td_onpadsmd": true,
"td_onroundshapesonly": false,
"td_ontrackend": false,
"td_onviapad": true
}
],
"teardrop_parameters": [
{
"td_curve_segcount": 0,
"td_height_ratio": 1.0,
"td_length_ratio": 0.5,
"td_maxheight": 2.0,
"td_maxlen": 1.0,
"td_target_name": "td_round_shape",
"td_width_to_size_filter_ratio": 0.9
},
{
"td_curve_segcount": 0,
"td_height_ratio": 1.0,
"td_length_ratio": 0.5,
"td_maxheight": 2.0,
"td_maxlen": 1.0,
"td_target_name": "td_rect_shape",
"td_width_to_size_filter_ratio": 0.9
},
{
"td_curve_segcount": 0,
"td_height_ratio": 1.0,
"td_length_ratio": 0.5,
"td_maxheight": 2.0,
"td_maxlen": 1.0,
"td_target_name": "td_track_end",
"td_width_to_size_filter_ratio": 0.9
}
],
"track_widths": [
0.0,
0.1524,

32
tests/reference/6_0_8/light_control-report.txt
View File

@ -27,22 +27,22 @@ Stackup:
Impedance controlled: YES
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
# Important sizes

32
tests/reference/6_0_8/light_control-report.txt_2
View File

@ -27,22 +27,22 @@ Stackup:
Impedance controlled: YES
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
# Important sizes

32
tests/reference/6_0_8/light_control-report_simple.txt
View File

@ -25,22 +25,22 @@ Stackup:
Impedance controlled: YES
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
Materials:

32
tests/reference/7_0_0/light_control-report.txt
View File

@ -27,22 +27,22 @@ Stackup:
Impedance controlled: YES
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | PTFE natural | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | FR4 natural | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | Polyimide | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
# Important sizes

32
tests/reference/7_0_0/light_control-report.txt_2
View File

@ -27,22 +27,22 @@ Stackup:
Impedance controlled: YES
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | PTFE natural | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | FR4 natural | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | Polyimide | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
# Important sizes

1
tests/reference/7_0_0/light_control-report_simple.txt
View File

@ -1 +0,0 @@
../6_0_8/light_control-report_simple.txt

64
tests/reference/7_0_0/light_control-report_simple.txt Normal file
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@ -0,0 +1,64 @@
PCB Specifications:
Size:
- 59.69x48.26 mm
Class: 6D
Track width: ≥ 0.15 mm
Insulation distance: ≥ 0.15 mm
Minimum drill size: ≥ 0.35 mm (finished metalized hole: 0.25 mm)
Minimum slot width: ≥ 0.6 mm
Ring collar: ≥ 0.08 mm
Special features:
- Edge connector: yes, bevelled
- Castellated pads
- Edge plating
Stackup:
Impedance controlled: YES
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | PTFE natural | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | FR4 natural | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | Polyimide | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
Materials:
- FR4 / Kapton, 1.6 mm
- ENIG
- 4 layers
- 35 µm copper thickness
Solder mask:
- TOP / BOTTOM
- Top: Blue / Bottom: Red
Marking:
- TOP / BOTTOM screen printing
- Silk: Top: White / Bottom: Black
Other markings:
- ROHS / UL / Date - Yes if available