[Stack-up][Fixed] Problems when using more than one dielectric
Fixes #328
This commit is contained in:
Salvador E. Tropea
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@ -40,6 +40,8 @@ and this project adheres to [Semantic Versioning](https://semver.org/spec/v2.0.0
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### Changed
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- Diff:
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- Now the default is to compare all the schematic pages. (#319)
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- Report:
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- loss tangent decimals, added one more.
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### Fixed
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- QR lib update: Problems when moving the footprint to the bottom for
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@ -51,6 +53,7 @@ and this project adheres to [Semantic Versioning](https://semver.org/spec/v2.0.0
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- Report: Problems when using NPTH holes with sizes that doesn't correspond to
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real drill tools. It generated bogus reports about wrong OARs. (#326)
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- BoM: Digi-key link in the HTML output.
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- Problems when using more than one dielectric in the stack-up. (#328)
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## [1.4.0] - 2022-10-12
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### Added
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@ -332,9 +332,10 @@ class Globals(FiltersOptions):
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self.impedance_controlled = value == 'yes'
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logger.debug("- Impedance controlled: "+value)
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elif name == 'layer':
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ly = PCBLayer.parse(e)
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stackup.append(ly)
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self.get_data_from_layer(ly, materials, thicknesses)
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lys = PCBLayer.parse(e)
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for ly in lys:
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stackup.append(ly)
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self.get_data_from_layer(ly, materials, thicknesses)
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if stackup:
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GS.stackup = stackup
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if len(materials):
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@ -1509,9 +1509,11 @@ class PCBLayer(object):
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def parse(items):
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name = 'PCB stackup layer'
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layer = PCBLayer()
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layers = [layer]
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n_layers = 1
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layer.name = _check_str(items, 1, name)
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for i in items[2:]:
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i_type = _check_is_symbol_list(i)
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i_type = _check_is_symbol_list(i, allow_orphan_symbol=('addsublayer'))
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tname = name+' '+i_type
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if i_type == 'type':
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layer.type = _check_str(i, 1, tname)
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@ -1525,9 +1527,19 @@ class PCBLayer(object):
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layer.epsilon_r = _check_float(i, 1, tname)
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elif i_type == 'loss_tangent':
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layer.loss_tangent = _check_float(i, 1, tname)
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elif i_type == 'addsublayer':
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new_layer = PCBLayer()
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new_layer.name = layer.name
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new_layer.type = layer.type
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layers.append(new_layer)
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layer = new_layer
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n_layers += 1
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else:
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logger.warning('Unknown layer attribute `{}`'.format(i))
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return layer
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if n_layers > 1:
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for n, layer in enumerate(layers):
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layer.name += ' ({}/{})'.format(n+1, n_layers)
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return layers
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def _symbol(name, content=None):
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@ -41,7 +41,7 @@ Impedance controlled: YES
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#?stackup
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|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
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#?stackup
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#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-8s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.2f,loss_tangent} |
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#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-8s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
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#?stackup
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# Important sizes
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@ -41,7 +41,7 @@ Impedance controlled: YES
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#?stackup
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|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
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#?stackup
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#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-8s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.2f,loss_tangent} |
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#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-8s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
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#?stackup
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# Important sizes
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@ -39,7 +39,7 @@ Impedance controlled: YES
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#?stackup
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|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
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#?stackup
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#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-8s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.2f,loss_tangent} |
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#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-8s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
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#?stackup
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Materials:
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@ -46,7 +46,8 @@
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(layer "In1.Cu" (type "copper") (thickness 0.035))
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(layer "dielectric 2" (type "core") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
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(layer "In2.Cu" (type "copper") (thickness 0.035))
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(layer "dielectric 3" (type "prepreg") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
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(layer "dielectric 3" (type "prepreg") (thickness 0.24) (material "Kapton") (epsilon_r 3.2) (loss_tangent 0.004)
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addsublayer (thickness 0.24) (material "Kapton") (epsilon_r 3.2) (loss_tangent 0.004))
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(layer "B.Cu" (type "copper") (thickness 0.035))
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(layer "B.Mask" (type "Bottom Solder Mask") (color "Red") (thickness 0.01) (material "Dry Film") (epsilon_r 3.3) (loss_tangent 0))
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(layer "B.Paste" (type "Bottom Solder Paste"))
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@ -4,7 +4,7 @@ Board size: 59.69x48.26 mm (2.35x1.9 inches)
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- This is the size of the rectangle that contains the board
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- Thickness: 1.6 mm (63 mils)
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- Material: FR4
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- Material: FR4 / Kapton
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- Finish: ENIG
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- Layers: 4
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- Copper thickness: 35 µm
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@ -31,15 +31,16 @@ Impedance controlled: YES
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|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
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| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
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| F.Paste | Top Solder Paste | | | | | |
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| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.00 |
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| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
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| F.Cu | copper | | 35 | | | |
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| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.02 |
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| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
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| In1.Cu | copper | | 35 | | | |
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| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.02 |
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| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
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| In2.Cu | copper | | 35 | | | |
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| dielectric 3 | prepreg | | 480 | FR4 | 4.5 | 0.02 |
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| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
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| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
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| B.Cu | copper | | 35 | | | |
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| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.00 |
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| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
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| B.Paste | Bottom Solder Paste | | | | | |
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| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
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@ -4,7 +4,7 @@ Board size: 59.69x48.26 mm (2.35x1.9 inches)
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- This is the size of the rectangle that contains the board
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- Thickness: 1.6 mm (63 mils)
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- Material: FR4
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- Material: FR4 / Kapton
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- Finish: ENIG
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- Layers: 4
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- Copper thickness: 35 µm
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@ -31,15 +31,16 @@ Impedance controlled: YES
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|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
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| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
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| F.Paste | Top Solder Paste | | | | | |
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| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.00 |
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| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
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| F.Cu | copper | | 35 | | | |
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| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.02 |
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| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
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| In1.Cu | copper | | 35 | | | |
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| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.02 |
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| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
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| In2.Cu | copper | | 35 | | | |
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| dielectric 3 | prepreg | | 480 | FR4 | 4.5 | 0.02 |
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| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
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| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
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| B.Cu | copper | | 35 | | | |
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| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.00 |
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| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
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| B.Paste | Bottom Solder Paste | | | | | |
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| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
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@ -29,21 +29,22 @@ Impedance controlled: YES
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|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
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| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
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| F.Paste | Top Solder Paste | | | | | |
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| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.00 |
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| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
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| F.Cu | copper | | 35 | | | |
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| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.02 |
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| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
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| In1.Cu | copper | | 35 | | | |
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| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.02 |
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| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
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| In2.Cu | copper | | 35 | | | |
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| dielectric 3 | prepreg | | 480 | FR4 | 4.5 | 0.02 |
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| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
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| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
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| B.Cu | copper | | 35 | | | |
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| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.00 |
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| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
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| B.Paste | Bottom Solder Paste | | | | | |
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| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
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Materials:
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- FR4, 1.6 mm
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- FR4 / Kapton, 1.6 mm
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- ENIG
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- 4 layers
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- 35 µm copper thickness
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