PCB Specifications:
Size:

- 59.69x48.26 mm

Class: 6D

Track width: ≥ 0.15 mm

Insulation distance: ≥ 0.15 mm

Minimum drill size: ≥ 0.35 mm (finished metalized hole: 0.25 mm)

Minimum slot width: ≥ 0.6 mm

Ring collar: ≥ 0.08 mm

Special features:

- Edge connector: yes, bevelled
- Castellated pads
- Edge plating

Stackup:

Impedance controlled: YES

| Name                 | Type                 | Color            | Thickness | Material        | Epsilon_r | Loss tangent |
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
| F.SilkS              | Top Silk Screen      | White            |           | Liquid Photo    |           |              |
| F.Paste              | Top Solder Paste     |                  |           |                 |           |              |
| F.Mask               | Top Solder Mask      | Blue             |        10 | Liquid Ink      |       3.3 |        0.000 |
| F.Cu                 | copper               |                  |        35 |                 |           |              |
| dielectric 1         | prepreg              | PTFE natural     |       480 | FR4             |       4.5 |        0.020 |
| In1.Cu               | copper               |                  |        35 |                 |           |              |
| dielectric 2         | core                 | FR4 natural      |       480 | FR4             |       4.5 |        0.020 |
| In2.Cu               | copper               |                  |        35 |                 |           |              |
| dielectric 3 (1/2)   | prepreg              | Polyimide        |       240 | Kapton          |       3.2 |        0.004 |
| dielectric 3 (2/2)   | prepreg              |                  |       240 | Kapton          |       3.2 |        0.004 |
| B.Cu                 | copper               |                  |        35 |                 |           |              |
| B.Mask               | Bottom Solder Mask   | Red              |        10 | Dry Film        |       3.3 |        0.000 |
| B.Paste              | Bottom Solder Paste  |                  |           |                 |           |              |
| B.SilkS              | Bottom Silk Screen   | Black            |           | Direct Printing |           |              |

Materials:

- FR4 / Kapton, 1.6 mm
- ENIG
- 4 layers
- 35 µm copper thickness

Solder mask:

- TOP / BOTTOM
- Top: Blue / Bottom: Red

Marking:

- TOP / BOTTOM screen printing
- Silk: Top: White / Bottom: Black

Other markings:

- ROHS / UL / Date - Yes if available