# PCB Board size: 59.69x48.26 mm (2.35x1.9 inches) - This is the size of the rectangle that contains the board - Thickness: 1.6 mm (63 mils) - Material: FR4 / Kapton - Finish: ENIG - Layers: 4 - Copper thickness: 35 µm Solder mask: TOP / BOTTOM - Color: Top: Blue / Bottom: Red Silk screen: TOP / BOTTOM - Color: Top: White / Bottom: Black Special features: - Edge connector: yes, bevelled - Castellated pads - Edge plating Stackup: Impedance controlled: YES | Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent | |----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------| | F.SilkS | Top Silk Screen | White | | Liquid Photo | | | | F.Paste | Top Solder Paste | | | | | | | F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 | | F.Cu | copper | | 35 | | | | | dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 | | In1.Cu | copper | | 35 | | | | | dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 | | In2.Cu | copper | | 35 | | | | | dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 | | dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 | | B.Cu | copper | | 35 | | | | | B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 | | B.Paste | Bottom Solder Paste | | | | | | | B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | | # Important sizes Clearance: 0.15 mm (6 mils) Track width: 0.15 mm (6 mils) - By design rules: 0.13 mm (5 mils) Drill: 0.35 mm (14 mils) - Vias: 0.35 mm (14 mils) [Design: 0.3 mm (12 mils)] - Pads: 0.7 mm (28 mils) - The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH) Via: 0.51/0.25 mm (20/10 mils) - By design rules: 0.46/0.2 mm (18/8 mils) - Micro via: no [0.2/0.1 mm (8/4 mils)] - Buried/blind via: no - Total: 56 (thru: 56 buried/blind: 0 micro: 0) Outer Annular Ring: 0.08 mm (3 mils) - By design rules: 0.08 mm (3 mils) Eurocircuits class: 6D - Using min drill 0.25 mm for an OAR of 0.13 mm # General stats Components count: (SMD/THT) - Top: 61/12 (SMD + THT) - Bottom: 0/0 (NONE) Defined tracks: - 0.15 mm (6 mils) - 0.3 mm (12 mils) - 0.64 mm (25 mils) Used tracks: - 0.15 mm (6 mils) (276) defined: yes - 0.3 mm (12 mils) (11) defined: yes - 0.64 mm (25 mils) (175) defined: yes Defined vias: - 0.51/0.25 mm (20/10 mils) - 0.89/0.51 mm (35/20 mils) Used vias: - 0.51/0.25 mm (20/10 mils) (Count: 23, Aspect: 3.1 A) defined: yes - 0.89/0.51 mm (35/20 mils) (Count: 33, Aspect: 1.8 A) defined: yes Holes (excluding vias): - 0.8 mm (31 mils) (4) - 0.85 mm (33 mils) (2) - 0.95 mm (37 mils) (3) - 1.2 mm (47 mils) (20) - 3.2 mm (126 mils) (4) Oval holes: - 0.6x1.3 mm (24x51 mils) (2) Drill tools (including vias and computing adjusts and rounding): - 0.35 mm (14 mils) (23) - 0.6 mm (24 mils) (33) - 0.7 mm (28 mils) (2) - 0.9 mm (35 mils) (4) - 0.95 mm (37 mils) (2) - 1.05 mm (41 mils) (3) - 1.3 mm (51 mils) (20) - 3.2 mm (126 mils) (4) # Schematic ![Schematic](Schematic.svg){ width=16.5cm height=11.7cm } # PCB Layers ![Top copper and silkscreen](Layers/light_control-assembly-front.pdf){ width=16.5cm height=11.7cm } ![Bottom copper and silkscreen](Layers/light_control-assembly-bottom.pdf){ width=16.5cm height=11.7cm }