PCB Specifications: Size: - 59.69x48.26 mm Class: 6D Track width: ≥ 0.15 mm Insulation distance: ≥ 0.15 mm Minimum drill size: ≥ 0.25 mm (finished metalized hole: 0.15 mm) Minimum slot width: ≥ 0.6 mm Ring collar: ≥ 0.25 mm Special features: - Edge connector: yes, bevelled - Castellated pads - Edge plating Stackup: Impedance controlled: YES | Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent | |----------------------|----------------------|----------|-----------|-----------------|-----------|--------------| | F.SilkS | Top Silk Screen | White | | Liquid Photo | | | | F.Paste | Top Solder Paste | | | | | | | F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.00 | | F.Cu | copper | | 35 | | | | | dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.02 | | In1.Cu | copper | | 35 | | | | | dielectric 2 | core | | 480 | FR4 | 4.5 | 0.02 | | In2.Cu | copper | | 35 | | | | | dielectric 3 | prepreg | | 480 | FR4 | 4.5 | 0.02 | | B.Cu | copper | | 35 | | | | | B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.00 | | B.Paste | Bottom Solder Paste | | | | | | | B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | | Materials: - FR4, 1.6 mm - ENIG - 4 layers - 35 µm copper thickness Solder mask: - TOP / BOTTOM - Top: Blue / Bottom: Red Marking: - TOP / BOTTOM screen printing - Silk: Top: White / Bottom: Black Other markings: - ROHS / UL / Date - Yes if available PCB: ![Top copper and silkscreen](Layers/light_control-F_Cu+F_SilkS.svg){ width=16.5cm height=11.7cm }