KiBot/tests/reference/7_0_3/light_control-report.txt_2

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# PCB
Board size: 59.69x48.26 mm (2.35x1.9 inches)
- This is the size of the rectangle that contains the board
- Thickness: 1.6 mm (63 mils)
- Material: FR4 / Kapton
- Finish: ENIG
- Layers: 4
- Copper thickness: 35 µm
Solder mask: TOP / BOTTOM
- Color: Top: Blue / Bottom: Red
Silk screen: TOP / BOTTOM
- Color: Top: White / Bottom: Black
Special features:
- Edge connector: yes, bevelled
- Castellated pads
- Edge plating
Stackup:
Impedance controlled: YES
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | PTFE natural | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | FR4 natural | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | Polyimide | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
# Important sizes
Clearance: 0.15 mm (6 mils)
Track width: 0.15 mm (6 mils)
- By design rules: 0.13 mm (5 mils)
Drill: 0.35 mm (14 mils)
- Vias: 0.35 mm (14 mils) [Design: 0.3 mm (12 mils)]
- Pads: 0.7 mm (28 mils)
- The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH)
Via: 0.51/0.25 mm (20/10 mils)
- By design rules: 0.46/0.2 mm (18/8 mils)
- Micro via: yes [0.2/0.1 mm (8/4 mils)]
- Buried/blind via: yes
- Total: 56 (thru: 56 buried/blind: 0 micro: 0)
Outer Annular Ring: 0.08 mm (3 mils)
- By design rules: 0.08 mm (3 mils)
Eurocircuits class: 6D
- Using min drill 0.25 mm for an OAR of 0.13 mm
# General stats
Components count: (SMD/THT)
- Top: 61/12 (SMD + THT)
- Bottom: 0/0 (NONE)
Defined tracks:
- 0.15 mm (6 mils)
- 0.3 mm (12 mils)
- 0.64 mm (25 mils)
Used tracks:
- 0.15 mm (6 mils) (276) defined: yes
- 0.3 mm (12 mils) (11) defined: yes
- 0.64 mm (25 mils) (175) defined: yes
Defined vias:
- 0.51/0.25 mm (20/10 mils)
- 0.89/0.51 mm (35/20 mils)
Used vias:
- 0.51/0.25 mm (20/10 mils) (Count: 23, Aspect: 3.1 A) defined: yes
- 0.89/0.51 mm (35/20 mils) (Count: 33, Aspect: 1.8 A) defined: yes
Holes (excluding vias):
- 0.8 mm (31 mils) (4)
- 0.85 mm (33 mils) (2)
- 0.95 mm (37 mils) (3)
- 1.2 mm (47 mils) (20)
- 3.2 mm (126 mils) (4)
Oval holes:
- 0.6x1.3 mm (24x51 mils) (2)
Drill tools (including vias and computing adjusts and rounding):
- 0.35 mm (14 mils) (23)
- 0.6 mm (24 mils) (33)
- 0.7 mm (28 mils) (2)
- 0.9 mm (35 mils) (4)
- 0.95 mm (37 mils) (2)
- 1.05 mm (41 mils) (3)
- 1.3 mm (51 mils) (20)
- 3.2 mm (126 mils) (4)
# Schematic
![Schematic](../Schematic.svg){ width=16.5cm height=11.7cm }
# PCB Layers
![Top copper and silkscreen](../Layers/light_control-assembly-front.pdf){ width=16.5cm height=11.7cm }
![Bottom copper and silkscreen](../Layers/light_control-assembly-bottom.pdf){ width=16.5cm height=11.7cm }