KiBot/tests/reference/6_0_2/light_control-report.txt

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# PCB
Board size: 59.69x48.26 mm (2.35x1.9 inches)
- This is the size of the rectangle that contains the board
- Thickness: 1.6 mm (63 mils)
- Material: FR4
- Finish: ENIG
- Layers: 4
- Copper thickness: 35 µm
Solder mask: TOP / BOTTOM
- Color: Top: Blue / Bottom: Red
Silk screen: TOP / BOTTOM
- Color: Top: White / Bottom: Black
Special features:
- Edge connector: yes, bevelled
- Castellated pads
- Edge plating
Stackup:
Impedance controlled: YES
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.00 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.02 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.02 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 | prepreg | | 480 | FR4 | 4.5 | 0.02 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.00 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
# Important sizes
Clearance: 0.15 mm (6 mils)
Track width: 0.15 mm (6 mils)
- By design rules: 0.13 mm (5 mils)
Drill: 0.25 mm (10 mils)
- Vias: 0.25 mm (10 mils) [Design: 0.2 mm (8 mils)]
- Pads: 0.6 mm (24 mils)
Via: 0.51/0.25 mm (20/10 mils)
- By design rules: 0.46/0.2 mm (18/8 mils)
- Micro via: no [0.2/0.1 mm (8/4 mils)]
- Burried/blind via: no
Outer Annular Ring: 0.25 mm (10 mils)
- By design rules: 0.25 mm (10 mils)
Eurocircuits class: 6D
# General stats
Components count: (SMD/THT)
- Top: 61/12 (SMD + THT)
- Bottom: 0/0 (NONE)
Defined tracks:
- 0.15 mm (6 mils)
- 0.3 mm (12 mils)
- 0.64 mm (25 mils)
Used tracks:
- 0.15 mm (6 mils) (276) defined: yes
- 0.3 mm (12 mils) (11) defined: yes
- 0.64 mm (25 mils) (175) defined: yes
Defined vias:
- 0.51/0.25 mm (20/10 mils)
- 0.89/0.51 mm (35/20 mils)
Used vias:
- 0.51/0.25 mm (20/10 mils) (Count: 23, Aspect: 3.1 A) defined: yes
- 0.89/0.51 mm (35/20 mils) (Count: 33, Aspect: 1.8 A) defined: yes
Holes (excluding vias):
- 0.8 mm (31 mils) (4)
- 0.85 mm (33 mils) (2)
- 0.95 mm (37 mils) (3)
- 1.2 mm (47 mils) (20)
- 3.2 mm (126 mils) (4)
# Schematic
![Schematic](Schematic.svg){ width=16.5cm height=11.7cm }
# PCB Layers
![Top copper and silkscreen](Layers/light_control-F_Cu+F_SilkS.svg){ width=16.5cm height=11.7cm }
![Bottom copper and silkscreen](Layers/light_control-B_Cu+B_SilkS.svg){ width=16.5cm height=11.7cm }