[Report] Fixed converted file wasn't stored at `dir`

Closes #238
This commit is contained in:
Salvador E. Tropea 2022-07-25 11:40:24 -03:00
parent 30f708db0e
commit b5fc7e8c55
6 changed files with 150 additions and 9 deletions

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@ -24,6 +24,8 @@ and this project adheres to [Semantic Versioning](https://semver.org/spec/v2.0.0
- Problems with zones on multiple layers (#226)
- SCH Variants on KiCad 6:
- Problems with missing values in the title block.
- Report:
- Converted file wasn't stored at `dir` (#238)
### Changed
- The order in which main sections are parsed is now fixed.

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@ -730,9 +730,10 @@ class ReportOptions(BaseOptions):
if not self.do_convert:
return
command = self.ensure_tool('PanDoc')
out = self.expand_converted_output(GS.out_dir)
dir_out = os.path.dirname(os.path.abspath(fname))
out = self.expand_converted_output(dir_out)
logger.debug('Converting the report to: {}'.format(out))
resources = '--resource-path='+GS.out_dir
resources = '--resource-path='+dir_out
# Pandoc 2.2.1 doesn't support "--to pdf"
if not out.endswith('.'+self.convert_to):
logger.warning(W_WRONGEXT+'The conversion tool detects the output format using the extension')

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@ -102,13 +102,13 @@ Drill tools (including vias and computing adjusts and rounding):
# Schematic
![Schematic](Schematic.svg){ width=16.5cm height=11.7cm }
![Schematic](../Schematic.svg){ width=16.5cm height=11.7cm }
# PCB Layers
![Top copper and silkscreen](Layers/light_control-assembly-front.pdf){ width=16.5cm height=11.7cm }
![Top copper and silkscreen](../Layers/light_control-assembly-front.pdf){ width=16.5cm height=11.7cm }
![Bottom copper and silkscreen](Layers/light_control-assembly-bottom.pdf){ width=16.5cm height=11.7cm }
![Bottom copper and silkscreen](../Layers/light_control-assembly-bottom.pdf){ width=16.5cm height=11.7cm }

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@ -1 +0,0 @@
light_control-report.txt

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@ -0,0 +1,137 @@
# PCB
Board size: 59.69x48.26 mm (2.35x1.9 inches)
- This is the size of the rectangle that contains the board
- Thickness: 1.6 mm (63 mils)
- Material: FR4
- Finish: ENIG
- Layers: 4
- Copper thickness: 35 µm
Solder mask: TOP / BOTTOM
- Color: Top: Blue / Bottom: Red
Silk screen: TOP / BOTTOM
- Color: Top: White / Bottom: Black
Special features:
- Edge connector: yes, bevelled
- Castellated pads
- Edge plating
Stackup:
Impedance controlled: YES
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.00 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.02 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.02 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 | prepreg | | 480 | FR4 | 4.5 | 0.02 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.00 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
# Important sizes
Clearance: 0.15 mm (6 mils)
Track width: 0.15 mm (6 mils)
- By design rules: 0.13 mm (5 mils)
Drill: 0.35 mm (14 mils)
- Vias: 0.35 mm (14 mils) [Design: 0.3 mm (12 mils)]
- Pads: 0.7 mm (28 mils)
- The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH)
Via: 0.51/0.25 mm (20/10 mils)
- By design rules: 0.46/0.2 mm (18/8 mils)
- Micro via: no [0.2/0.1 mm (8/4 mils)]
- Burried/blind via: no
Outer Annular Ring: 0.08 mm (3 mils)
- By design rules: 0.08 mm (3 mils)
Eurocircuits class: 10C
# General stats
Components count: (SMD/THT)
- Top: 61/12 (SMD + THT)
- Bottom: 0/0 (NONE)
Defined tracks:
- 0.15 mm (6 mils)
- 0.3 mm (12 mils)
- 0.64 mm (25 mils)
Used tracks:
- 0.15 mm (6 mils) (276) defined: yes
- 0.3 mm (12 mils) (11) defined: yes
- 0.64 mm (25 mils) (175) defined: yes
Defined vias:
- 0.51/0.25 mm (20/10 mils)
- 0.89/0.51 mm (35/20 mils)
Used vias:
- 0.51/0.25 mm (20/10 mils) (Count: 23, Aspect: 3.1 A) defined: yes
- 0.89/0.51 mm (35/20 mils) (Count: 33, Aspect: 1.8 A) defined: yes
Holes (excluding vias):
- 0.8 mm (31 mils) (4)
- 0.85 mm (33 mils) (2)
- 0.95 mm (37 mils) (3)
- 1.2 mm (47 mils) (20)
- 3.2 mm (126 mils) (4)
Oval holes:
- 0.6x1.3 mm (24x51 mils) (2)
Drill tools (including vias and computing adjusts and rounding):
- 0.35 mm (14 mils) (23)
- 0.6 mm (24 mils) (33)
- 0.7 mm (28 mils) (2)
- 0.9 mm (35 mils) (4)
- 0.95 mm (37 mils) (2)
- 1.05 mm (41 mils) (3)
- 1.3 mm (51 mils) (20)
- 3.2 mm (126 mils) (4)
# Schematic
![Schematic](../Schematic.svg){ width=16.5cm height=11.7cm }
# PCB Layers
![Top copper and silkscreen](../Layers/light_control-assembly-front.pdf){ width=16.5cm height=11.7cm }
![Bottom copper and silkscreen](../Layers/light_control-assembly-bottom.pdf){ width=16.5cm height=11.7cm }

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@ -1009,11 +1009,12 @@ def test_report_simple_2(test_dir):
prj = 'light_control'
ctx = context.TestContext(test_dir, prj, 'report_simple_2', POS_DIR)
ctx.run()
ctx.expect_out_file(prj+'-report.txt')
f_report = os.path.join('report', prj+'-report.txt')
ctx.expect_out_file(f_report)
ctx.expect_out_file(prj+'-report_simple.txt')
ctx.compare_txt(prj+'-report.txt', prj+'-report.txt_2')
ctx.compare_txt(f_report, prj+'-report.txt_2')
ctx.compare_txt(prj+'-report_simple.txt')
ctx.expect_out_file(prj+'-report.pdf')
ctx.expect_out_file(f_report.replace('.txt', '.pdf'))
ctx.clean_up(keep_project=True)

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@ -54,5 +54,6 @@ outputs:
- name: 'report_full'
comment: "Full design report"
type: report
dir: report
options:
do_convert: true