68 lines
2.4 KiB
Plaintext
68 lines
2.4 KiB
Plaintext
PCB Specifications:
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Size:
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- 59.69x48.26 mm
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Class: 6D
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Track width: ≥ 0.15 mm
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Insulation distance: ≥ 0.15 mm
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Minimum drill size: ≥ 0.25 mm (finished metalized hole: 0.15 mm)
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Minimum slot width: ≥ 0.6 mm
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Ring collar: ≥ 0.25 mm
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Special features:
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- Edge connector: yes, bevelled
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- Castellated pads
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- Edge plating
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Stackup:
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Impedance controlled: YES
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| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
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|----------------------|----------------------|----------|-----------|-----------------|-----------|--------------|
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| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
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| F.Paste | Top Solder Paste | | | | | |
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| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.00 |
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| F.Cu | copper | | 35 | | | |
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| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.02 |
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| In1.Cu | copper | | 35 | | | |
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| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.02 |
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| In2.Cu | copper | | 35 | | | |
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| dielectric 3 | prepreg | | 480 | FR4 | 4.5 | 0.02 |
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| B.Cu | copper | | 35 | | | |
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| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.00 |
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| B.Paste | Bottom Solder Paste | | | | | |
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| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
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Materials:
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- FR4, 1.6 mm
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- ENIG
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- 4 layers
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- 35 µm copper thickness
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Solder mask:
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- TOP / BOTTOM
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- Top: Blue / Bottom: Red
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Marking:
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- TOP / BOTTOM screen printing
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- Silk: Top: White / Bottom: Black
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Other markings:
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- ROHS / UL / Date - Yes if available
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PCB:
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{ width=16.5cm height=11.7cm }
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